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Express Computer Systems :: Sun Microsystems Hardware :: Sun Servers :: Sun Netra Series :: Sun Netra CP2160 Blade
Sun Netra CP2160 Blade

 

Sun Netra CP2160 Blade 

 

Used Sun Netra CP2160 Blade

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Details
 
Part # Sun Netra CP2160 Blade

Specifications:

Processor

Processor
One 650-MHz UltraSPARC IIi processor
Cache
Level 1: 32 KB
Level 2: 512 KB

Memory

Expandable memory
1 GB of on-board memory (expandable to 2 GB)
Flash memory
1 MB on-board flash memory, 7 MB of user-programmable memory

Bus Interface

Compact PCI Bus
PICMG (PCI Industrial Computer Manufacturers Group) 2.0 compliant, 33 MHz at 32/64 bits
Connector
2 mm pin and socket
Memory read/write bandwidth
500 MB/sec. (estimated)
System management
Sun Microcontroller IPMI (Intelligent Platform Management Interface)

Standard Interfaces

Network
Two 10/100 Mbps autosensing Ethernet ports; two MII (back panel)
PMC
Two PMC slots, 5-volt PMC
Serial
Two RS-232C asynchronous (rear panel) ports, one DIN8 (front panel) port
USB
Two USB ports (rear panel)

Connectors

Rear connectors: two USB, alarms out, external reset, two Ethernet, PMC
Rear (J3)
First PMC, hot-swap signals
Rear (J4)
No connectors
Rear (J5)
Two Ethernet (10/100) TP, two USB ports, I2C bus, second PMC
Front
Two Ethernet (10/100) RJ-45, one serial (mini-DB-9)

Supervisory

PICMG 2.9 System Management compliant
3-level watchdog timer; local alarm capabilities for power, voltage, thermal; field-replaceable unit (FRU) ID

Switches

Momentary reset button/switch and abort button/switch (both recessed from front panel)

TOD/NVRAM

Clock/calendar
8 KB of NVRAM (nonvolatile single inline memory module) no battery

Front Panel LEDS

Power OK
PICMG hot-swap
One alarm/user LED

Environment

Power
25 W typical at 650 MHz (est. includes 1 GB memory)
Power input
3.3, 5, +12, -12V required
Operating temperature
5 degrees C to 40 degrees C (41 degrees F to 104 degrees F), 5% to 95% relative humidity
Nonoperating temperature
-40 degrees C to 70 degrees C (-38 degrees F to 158 degrees F), 5% to 95% relative humidity
Cooling
300 LFM
Relative humidity
0% to 95% operational, noncondensing
Altitude
60 m (.04 mi.) below sea level to 4000 m (2.5 mi.) above sea level
Seismic
Meets GR-63-CORE and GR-1089-CORE requirements for earthquake risk Zone 4

Regulations

Meets or exceeds the following requirements:
EMC
U.S.: FCC Part 15 Class A
Canada: ICES 003 Class A
Japan: VCCI Class A
Europe: EN 55022 & 55024
Taiwan: BSMI Approval
Regulatory markings
UL 1950
CSA C2.22
EN60950
TUV
Telecom Environment Certification
Telcordia: NEBS Level 3

PICM Conformance

PICMG 2.0, Rev 3 CompactPCI (Power and Form Factor only)
PICMG 2.1, Rev 2 HA hot-swap
PICMG 2.9, Rev 1 IPMI System Management
PICMG 2.10, Rev 1 Keying of cPCI Board and Backplane
PICMG 2.14, Rev 1 IP Backplane
PICMG 2.15, Rev 1 PCI Telecom Mezzanine/Carrier Card

MTBF

160,000 hours
 

 

 

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